Ibhodi ye-PCB yonxibelelwano lwe-elektroniki ye-ceramic eyenziwe ngegolide
iingenelo
Iingenelo ezintlanu zokukunika amava alungileyo omsebenzisi.
Iziqinisekiso zemveliso ezininzi
Ubugcisa obuhle kakhulu
Ilula
Ubungakanani obuncinci
Ubomi benkonzo ende
uphawu
☑Isebenzisa i-ceramic substrate, idibanisa ukuhanjiswa kobushushu obuphezulu, i-coefficient ephantsi yokwandiswa, kunye namandla aphezulu oomatshini.
☑ Umaleko weplati yegolide unokuqinisekisa ukuba i-conductivity yayo ihlala izinzile ixesha elide, ukumelana ne-oxidation, kunye nokuthembeka kwe-welding.
☑ Yenziwe ngobuchule, ukhetho lomgangatho.
Ububanzi bemveliso yesicelo
Ipharamitha yemveliso
Igama lemveliso | Ibhodi ye-PCB yonxibelelwano lwe-elektroniki ye-ceramic eyenziwe ngegolide |
Yenzelwe wena | Nika iinkonzo ezenzelwe wena |
Izixhobo ezisebenzayo | Izinto ezichasene noxinzelelo oluphezulu ezifana ne-99 alumina, i-aluminium nitride, i-beryllium oxide, njl. |
Unyango lomphezulu | Xhasa iinkqubo zonyango lomphezulu ezifana ne-nickel palladium plating, i-sputtered copper, i-electroplated copper, njl. |
Ubushushu bokusebenza | -55℃~850℃ |
Ukuqhuba kobushushu | I-okside ye-aluminiyam 24-28W/(m · K), i-aluminiyam nitride 170-230W/m · K |
Iimeko zokugcina | Ubushushu 5 ℃ ~ 35 ℃, ukufuma okuthelekisekayo ≤ 75% RH |
Amatyala eSicelo
inkcazo2
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